Job Details

Sr. RF Package Design Engineer

Advertiser
Lux Semiconductors
Location
Albany, New York, United States
Rate
-
Sr. RF Package Design Engineer (Salary: $130-180k. Experience, location, & equity plan dependent)

Company
Lux Semiconductors is a microelectronics startup delivering 'More than Moore' through advanced system-level packaging that leverages the company's proprietary System-on-FoilTM platform designed for heterogeneous integration. The company has received over $5M in funding for the development of this exciting new platform, including from the Department of Energy, Department of Defense, and National Science Foundation. Lux is also backed by one of America's top accelerators, Techstars, and other venture investors. The startup is led by its two founders, located at SUNY Polytechnic in Albany, NY and Oak Ridge National Lab in Oak Ridge, TN.

Lux is rapidly expanding its team, and this position will be among the first within Lux's Architecture and Design group. This group will be responsible for the design and development of new System-on-Foil platform technologies contributing to cutting-edge developments set to push state-of-the-art semiconductor packaging.

Job Description
The Sr. RF Package Design Engineer will be responsible for overseeing the definition, design, development, and verification of the System-on-Foil packaging platform. The two key focus areas for this position include:
  • System-on-Foil Roadmapping -Define the SoF roadmap by classifying target application segments, gathering customer performance requirements, identifying necessary SoF building block components, and defining component performance parameters and target values.
  • System-on-Foil Test Vehicle Design - Based on roadmapping needs, design and implement test vehicle demonstrations to extract electrical, thermal, and reliability performance data. This process will include component selection, schematic entry, circuit simulations, component placement and routing, design verification, and test. A portion of the design work will be performed in-house by the candidate, while other portions will be outsourced, as directed by the candidate.
Responsibilities
  • Roadmap System-on-Foil. Design and implement test vehicle demonstrations to showcase performance
  • Establish the System-on-Foil design flow, which may involve collaborating with EDA partners to identify most efficient design methods
  • Define and implement a co-design strategy for performance-cost optimization at package and system level
  • Manage and assist 3rd party efforts: 1) 3D thermomechanical simulation, 2) Electrical, thermal, and mechanical test, and 3) System-on-Foil PDK and ADK development
  • Contribute to package design rules and system development
  • Interface with foundries, OSATs, and customers to assist with development of System-on-Foil designs
  • Development of intellectual property
Qualifications
  • Ph.D./Master's in Electrical Engineering or related field
  • 10+ years of RF Package/PCB design experience
  • Strong technical background in both design and electrical analysis
  • Technical understanding in the areas of silicon-package-board interaction
  • Experience with design and EM simulation tools: Mentor, Cadence tools, SPICE, Ansys tools, etc.
  • Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx).
  • Knowledge of advanced package architectures and fabrication processes
  • Ability to work autonomously, assume responsibility for tasks, set priorities, and adapt to changing needs
  • The employee will have a high degree of independence and technical decision making
  • Preference for candidates with experience in patent application processes
Location
This position will be conducted remotely. Office location available at SUNY Polytechnic in Albany, NY.

?Eligibility Requirements
U.S. Citizen, National, or Permanent Resident

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